Semiconductor Processing Equipment
Turn-key sub-assemblies are supplied just-in-time for wafer processing equipment, including ion etch tools, ion implant systems and in-line vacuum applications. Solutions include multi-layer circuit boards with multiple cable termination on the vacuum side, heated paddle subassemblies and multi-cable vacuum penetrations. Douglas Electrical Components has become identified as a leader in high quality, cost-effective and fast turnaround feedthroughs in multiple applications for this extremely demanding industry.
Solutions
- High vacuum containment for beam mask writing tool, demanding quick turnaround sealing of customer supplied complex flanges using epoxy sealing technologies.
- Optical detention of wafer cassette position in load lock, requiring single or multiple optical fiber feedthrus.
- Pogo pin feedthru used for quick and easy mating to contact pads on PCB. Wire side is also connectorized for quick and accurate install.
See all solutions
All Semiconductor Processing Equipment Solutions
- High vacuum containment for beam mask writing tool, demanding quick turnaround sealing of customer supplied complex flanges using epoxy sealing technologies.
- Optical detention of wafer cassette position in load lock, requiring single or multiple optical fiber feedthrus.
- Pogo pin feedthru used for quick and easy mating to contact pads on PCB. Wire side is also connectorized for quick and accurate install.
- Process chamber diagnostics requiring low out-gassing sealed thermocouple and shielded cable feedthrus to monitor temperature and critical process gases.
- Process chamber power, requiring sealed high current studs to 750 amps to meet power needs.
- Seal to fully populated rigid PCB board. Provides multiple signal, power and air lines thru a single port on the vacuum chamber.
- Water transfer drive and motor system requiring sealed connector/harness subassemblies to communicate low level power and sensor signals through a single, compact penetration.
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